KIOXIA at CES 2026: BiCS Flash, SSDs, Automotive UFS, and AI Storage
BitwitJanuary 8, 202623 min26,948 views
28 connectionsΒ·40 entities in this videoβKIOXIA's BiCS Flash Technology Evolution
- π‘ KIOXIA's BiCS 8 generation utilizes CMOS bonded array (CBA) technology, stacking memory wafers separately from logic wafers to optimize processing temperatures and improve transistor performance.
- π Future generations, BiCS 9 and 10, will introduce the Separate Command Address (SCA) protocol, which separates command and address information from the data bus to enhance efficiency and enable higher frequencies.
- π BiCS 10 will also feature a 332-layer design for NAND flash, significantly increasing density.
- π¦ A remarkable achievement is the 32-die stack in a single package, enabling up to 8 terabytes per package, a substantial increase from previous generations.
Advanced SSDs and AI Storage Solutions
- π― KIOXIA showcased LC9 SSDs utilizing the 8TB packages, with a demonstration of a petabyte of flash storage across multiple drives.
- π§ For AI, KIOXIA developed Isaac software to enhance retrieval augmented generation (RAG) by allowing vector databases to be stored on SSDs instead of DRAM, mitigating DRAM limitations.
- β‘ The BG7 series are DRAMless client SSDs available in capacities up to 2TB, utilizing host memory buffer (HBM) technology.
- π Enterprise SSDs are color-coded: green for client, blue for enterprise (highest performance), and orange for data center class.
- π¦ New EDSFF form factors (E3.L, E3.S, E1.S) are designed specifically for flash memory, offering improved heat dissipation and density compared to traditional 2.5-inch drives.
Automotive Storage Solutions
- π KIOXIA is advancing automotive UFS (Universal Flash Storage), moving from UFS 3.1 to the new UFS 4.1 standard.
- β‘ UFS 4.1 doubles the interface speed from 3.1 to approximately 4 GB/sec, significantly improving data retrieval and write performance for automotive systems like cockpits and IVI.
- π± While UFS originated in smartphones, it's now a major storage application in automotive and is globally adopted, with UFS 4.1 expected in vehicles within a year or two.
Q&A and Future Outlook
- β Discussions covered heat dissipation in M.2 SSDs, with EDSFF cases acting as heat sinks for higher power applications.
- π± UFS 4.1 is also being adopted in smartphones, with performance similar to 4.0 but with updated features.
- πΎ The maximum capacity for the smallest BG7 client SSD is 2 terabytes.
- π¦ KIOXIA does not have a specific name for their 32-die NAND package beyond its description.
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Whatβs Discussed
BiCS Flash MemoryCMOS Bonded Array (CBA)Separate Command Address (SCA) protocol332-layer NAND32-die stack8 terabyte packageLC9 SSDPetabyte storageAI StorageIsaac SoftwareRetrieval Augmented Generation (RAG)Vector DatabaseDRAMless SSDHost Memory Buffer (HBM)EDSFF form factorsAutomotive UFSUFS 4.1CES 2026
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